Huawei revealed plans to open source its UB‑Mesh interconnect, a system that combines a CLOS‑based backbone with multidimensional rack‑level meshes to streamline communication among CPUs, GPUs, memory, and networking equipment in massive AI data centers. The company claims the design can keep costs low even at scales of thousands of nodes, citing an 8,192‑node deployment and bandwidth exceeding one terabyte per second per device with sub‑microsecond latency. Huawei chief scientist Heng Liao said the protocol will be published with a free license at an upcoming conference, while industry observers note the challenge of gaining broad adoption amid existing standards and geopolitical concerns. Leer más →

Huawei revealed plans to open source its UB‑Mesh interconnect, a system that combines a CLOS‑based backbone with multidimensional rack‑level meshes to streamline communication among CPUs, GPUs, memory, and networking equipment in massive AI data centers. The company claims the design can keep costs low even at scales of thousands of nodes, citing an 8,192‑node deployment and bandwidth exceeding one terabyte per second per device with sub‑microsecond latency. Huawei chief scientist Heng Liao said the protocol will be published with a free license at an upcoming conference, while industry observers note the challenge of gaining broad adoption amid existing standards and geopolitical concerns. Leer más →

Huawei revealed plans to open source its UB‑Mesh interconnect, a system that combines a CLOS‑based backbone with multidimensional rack‑level meshes to streamline communication among CPUs, GPUs, memory, and networking equipment in massive AI data centers. The company claims the design can keep costs low even at scales of thousands of nodes, citing an 8,192‑node deployment and bandwidth exceeding one terabyte per second per device with sub‑microsecond latency. Huawei chief scientist Heng Liao said the protocol will be published with a free license at an upcoming conference, while industry observers note the challenge of gaining broad adoption amid existing standards and geopolitical concerns. Leer más →

Huawei revealed plans to open source its UB‑Mesh interconnect, a system that combines a CLOS‑based backbone with multidimensional rack‑level meshes to streamline communication among CPUs, GPUs, memory, and networking equipment in massive AI data centers. The company claims the design can keep costs low even at scales of thousands of nodes, citing an 8,192‑node deployment and bandwidth exceeding one terabyte per second per device with sub‑microsecond latency. Huawei chief scientist Heng Liao said the protocol will be published with a free license at an upcoming conference, while industry observers note the challenge of gaining broad adoption amid existing standards and geopolitical concerns. Leer más →

Huawei revealed plans to open source its UB‑Mesh interconnect, a system that combines a CLOS‑based backbone with multidimensional rack‑level meshes to streamline communication among CPUs, GPUs, memory, and networking equipment in massive AI data centers. The company claims the design can keep costs low even at scales of thousands of nodes, citing an 8,192‑node deployment and bandwidth exceeding one terabyte per second per device with sub‑microsecond latency. Huawei chief scientist Heng Liao said the protocol will be published with a free license at an upcoming conference, while industry observers note the challenge of gaining broad adoption amid existing standards and geopolitical concerns. Leer más →