Microsoft says it has achieved a breakthrough in cooling AI processors by using a micro‑fluidic system that channels coolant through tiny etched channels on the chip. The approach, which the company claims can deliver up to three times better cooling and cut silicon temperature rise by roughly 65 percent, could enable higher performance, tighter server packing and modest sustainability gains. Microsoft highlights the potential for more aggressive overclocking, reduced data‑center latency and improved waste‑heat utilization, positioning the innovation as a step toward more efficient AI workloads. Leia mais →