OpenAI has signed significant agreements with AMD and Broadcom to supply AI chips and accelerators for its data‑center deployments. The AMD deal focuses on large‑scale GPU production, while Broadcom will provide custom AI accelerators and Ethernet systems. Both partnerships underline OpenAI's strategy to diversify its silicon supply and reduce reliance on a single vendor. However, the majority of the chips are still expected to be fabricated by Taiwan Semiconductor Manufacturing Company (TSMC), whose capacity constraints and geographic concentration remain a critical bottleneck for the broader AI and semiconductor industries. Leer más →

NVIDIA announced the production of its first Blackwell wafer at TSMC’s Phoenix, Arizona fab, marking a major step in domestic chip manufacturing for its AI hardware. The Blackwell platform, touted as more powerful and up to 25 times more cost‑ and energy‑efficient than its predecessor, is positioned for volume production and aims to strengthen ties with major AI players while reducing exposure to tariffs and geopolitical risks. CEO Jensen Huang highlighted the significance of the milestone for U.S. semiconductor leadership and noted ongoing plans to expand U.S. manufacturing capacity and invest heavily in AI infrastructure. Leer más →

Pezy Computing presented its SC4s processor, a large‑die, 5nm chip that embraces a Multiple Instructions Multiple Data (MIMD) design rather than the mainstream SIMD approach. The chip, fabricated by TSMC, features a die of roughly 556 mm² and aims to deliver hundreds of semi‑autonomous cores that can operate independently. Simulated workloads, including DGEMM and the Smith‑Waterman genome‑alignment algorithm, show substantial gains in power efficiency and performance compared with Pezy’s earlier SC3 design. While the results are still based on simulations, the company plans to move toward a successor using a sub‑3nm process. Leer más →

Pezy Computing presented its SC4s processor, a large‑die, 5nm chip that embraces a Multiple Instructions Multiple Data (MIMD) design rather than the mainstream SIMD approach. The chip, fabricated by TSMC, features a die of roughly 556 mm² and aims to deliver hundreds of semi‑autonomous cores that can operate independently. Simulated workloads, including DGEMM and the Smith‑Waterman genome‑alignment algorithm, show substantial gains in power efficiency and performance compared with Pezy’s earlier SC3 design. While the results are still based on simulations, the company plans to move toward a successor using a sub‑3nm process. Leer más →

Pezy Computing presented its SC4s processor, a large‑die, 5nm chip that embraces a Multiple Instructions Multiple Data (MIMD) design rather than the mainstream SIMD approach. The chip, fabricated by TSMC, features a die of roughly 556 mm² and aims to deliver hundreds of semi‑autonomous cores that can operate independently. Simulated workloads, including DGEMM and the Smith‑Waterman genome‑alignment algorithm, show substantial gains in power efficiency and performance compared with Pezy’s earlier SC3 design. While the results are still based on simulations, the company plans to move toward a successor using a sub‑3nm process. Leer más →

Pezy Computing presented its SC4s processor, a large‑die, 5nm chip that embraces a Multiple Instructions Multiple Data (MIMD) design rather than the mainstream SIMD approach. The chip, fabricated by TSMC, features a die of roughly 556 mm² and aims to deliver hundreds of semi‑autonomous cores that can operate independently. Simulated workloads, including DGEMM and the Smith‑Waterman genome‑alignment algorithm, show substantial gains in power efficiency and performance compared with Pezy’s earlier SC3 design. While the results are still based on simulations, the company plans to move toward a successor using a sub‑3nm process. Leer más →

Pezy Computing presented its SC4s processor, a large‑die, 5nm chip that embraces a Multiple Instructions Multiple Data (MIMD) design rather than the mainstream SIMD approach. The chip, fabricated by TSMC, features a die of roughly 556 mm² and aims to deliver hundreds of semi‑autonomous cores that can operate independently. Simulated workloads, including DGEMM and the Smith‑Waterman genome‑alignment algorithm, show substantial gains in power efficiency and performance compared with Pezy’s earlier SC3 design. While the results are still based on simulations, the company plans to move toward a successor using a sub‑3nm process. Leer más →

A senior administration official clarified that not all companies receiving CHIPS Act funding will be required to surrender equity to the government. While Intel’s subsidy may involve a stake, firms such as TSMC and Micron that have expanded U.S. manufacturing are exempt. The Commerce Department also signaled possible reallocation of up to $2 billion toward critical‑mineral projects to lessen reliance on China. Legal challenges could arise over equity clauses, but the administration appears focused on targeted support rather than broad ownership demands. Leer más →

Apple is advancing its AI initiatives, including on‑device intelligence and partnerships with large language models, while striving to meet its 2030 carbon‑neutral goal. The company faces slowed emissions reductions in its supply chain, mixed renewable‑energy commitments from major assemblers, and the energy‑intensive nature of AI development. Analysts note a tension between the need for advanced chips, frequent device upgrades, and the broader push for sustainability across Apple’s operations and its suppliers. Leer más →

China's Cyberspace Administration has called Nvidia to explain alleged backdoor risks in its H20 AI chips, which were designed for the Chinese market after U.S. export restrictions. Nvidia maintains its hardware contains no hidden access features. The regulator is also reviewing Nvidia's 2020 acquisition of Mellanox Technologies. Despite the investigation, demand for the H20 chip remains strong, with TSMC continuing production for Chinese developers and research institutions. The move adds uncertainty to Nvidia's relationship with its second‑largest market amid broader U.S.–China tech tensions. Leer más →

The Trump administration plans to announce tariffs on semiconductors and chips, which could disrupt U.S. hardware and AI companies. The specifics of these tariffs remain unclear. Leer más →